Much like multi-storey buildings in densely packed metropolises, three-dimensional (3D) chip structures are envisioned as a viable solution to skyrocketing transistor densities an...
Jongman Kim, Chrysostomos Nicopoulos, Dongkook Par...
The sustained push toward smaller and smaller technology sizes has reached a point where device reliability has moved to the forefront of concerns for next-generation designs. Sil...