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ISCA
2007
IEEE
110views Hardware» more  ISCA 2007»
13 years 11 months ago
A novel dimensionally-decomposed router for on-chip communication in 3D architectures
Much like multi-storey buildings in densely packed metropolises, three-dimensional (3D) chip structures are envisioned as a viable solution to skyrocketing transistor densities an...
Jongman Kim, Chrysostomos Nicopoulos, Dongkook Par...
ASPLOS
2006
ACM
13 years 11 months ago
Ultra low-cost defect protection for microprocessor pipelines
The sustained push toward smaller and smaller technology sizes has reached a point where device reliability has moved to the forefront of concerns for next-generation designs. Sil...
Smitha Shyam, Kypros Constantinides, Sujay Phadke,...