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    ISPD
    2005
    ACM
    151views Hardware» more  ISPD 2005»
    Thermal via placement in 3D ICs
    13 years 10 months ago
    Thermal via placement in 3D ICs
    Download  www.ece.umn.edu
    As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
    Brent Goplen, Sachin S. Sapatnekar
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