30 search results - page 5 / 6 » Temperature- and Cost-Aware Design of 3D Multiprocessor Arch... |
DAC
2006
ACM
14 years 6 months ago
2006
ACM
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
IJES
2007
13 years 5 months ago
2007
: The power density in high performance systems continues to rise with every process technology generation, thereby increasing the operating temperature and creating ‘hot spotsâ€...
CODES
2011
IEEE
12 years 5 months ago
2011
IEEE
Designing memory controllers for complex real-time and highperformance multi-processor systems-on-chip is challenging, since sufficient capacity and (real-time) performance must b...
DATE
2006
IEEE
13 years 11 months ago
2006
IEEE
The power density inside high performance systems continues to rise with every process technology generation, thereby increasing the operating temperature and creating “hot spot...
ISCA
2009
IEEE
14 years 15 hour ago
2009
IEEE
Caching techniques have been an efficient mechanism for mitigating the effects of the processor-memory speed gap. Traditional multi-level SRAM-based cache hierarchies, especially...