179 search results - page 35 / 36 » Temperature-aware global placement |
DAC
2007
ACM
14 years 6 months ago
2007
ACM
The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literatur...
VEE
2009
ACM
14 years 17 days ago
2009
ACM
Clusters provide powerful computing environments, but in practice much of this power goes to waste, due to the static allocation of tasks to nodes, regardless of their changing co...
ASPLOS
2006
ACM
13 years 11 months ago
2006
ACM
Growing on-chip wire delays are motivating architectural features that expose on-chip communication to the compiler. EDGE architectures are one example of communication-exposed mi...
GIS
2008
ACM
14 years 6 months ago
2008
ACM
Commercial aerial imagery websites, such as Google Maps, MapQuest, Microsoft Virtual Earth, and Yahoo! Maps, provide high- seamless orthographic imagery for many populated areas, ...
ICCAD
2004
IEEE
14 years 2 months ago
2004
IEEE
—In this paper, we present a new block budgeting algorithm which speeds up timing closure in timing driven hierarchical flows. After a brief description of the addressed flow, ...