125 search results - page 3 / 25 » Tera-scale computing and interconnect challenges |
SC
2009
ACM
14 years 6 days ago
2009
ACM
Recent and future parallel clusters and supercomputers use SMPs and multi-core processors as basic nodes, providing a huge amount of parallel resources. These systems often have h...
ICPADS
1998
IEEE
13 years 9 months ago
1998
IEEE
With respect to scalability and arbitrary topologies of the underlying networks in multiprogramming and multithread environment, fault tolerance in acknowledged ATAB and concurren...
DAC
2006
ACM
14 years 6 months ago
2006
ACM
Increasing resistivity of copper with scaling and rising demands on current density requirements are driving the need to identify new wiring solutions for deep nanometer scale VLS...
IPPS
2003
IEEE
13 years 10 months ago
2003
IEEE
Tiled architectures can provide a model for early estimation of global interconnect costs. A design exploration tool for reconfigurable architectures is currently under developmen...
DAC
1999
ACM
13 years 9 months ago
1999
ACM
IC inductance extraction generally produces either port inductances based on simplified current path assumptions or a complete partial inductance matrix. Combining either of thes...