245 search results - page 48 / 49 » The reproducing placement problem with applications |
ASPDAC
2009
ACM
14 years 9 days ago
2009
ACM
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
ICUIMC
2011
ACM
12 years 9 months ago
2011
ACM
Physical layer capture in WLANs makes a receiver to decode a relatively strong packet in a collision. According to recent works, an augmented physical layer capture handles interf...
MOBISYS
2008
ACM
14 years 5 months ago
2008
ACM
Using 802.11 concurrently for communications and positioning is problematic, especially if location-based services (e.g., indoor navigation) are concurrently executed with real-ti...
ICCD
2005
IEEE
14 years 2 months ago
2005
IEEE
Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
DATE
2006
IEEE
13 years 12 months ago
2006
IEEE
same level of system-level CAD support that is now commonplace in the IC industry.Recent advances in microfluidics are expected to lead to sensor systems for high-throughput bioche...