3 search results - page 1 / 1 » Thermal Herding: Microarchitecture Techniques for Controllin... |
HPCA
2007
IEEE
14 years 5 months ago
2007
IEEE
3D integration technology greatly increases transistor density while providing faster on-chip communication. 3D implementations of processors can simultaneously provide both laten...
ISCA
2006
IEEE
13 years 4 months ago
2006
IEEE
Power density continues to increase exponentially with each new technology generation, posing a major challenge for thermal management in modern processors. Much past work has exa...
VLSID
2009
IEEE
14 years 5 months ago
2009
IEEE
The Translation Look-aside Buffer (TLB) is a very important part in the hardware support for virtual memory management implementation of high performance embedded systems. The TLB...