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    ASPDAC
    2007
    ACM
    164views Hardware» more  ASPDAC 2007»
    Thermal-Aware 3D IC Placement Via Transformation
    13 years 8 months ago
    Thermal-Aware 3D IC Placement Via Transformation
    Download  cadlab.cs.ucla.edu
    - 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
    Jason Cong, Guojie Luo, Jie Wei, Yan Zhang
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    DAC
    2011
    ACM
    250views Computer Architecture» more  DAC 2011»
    Thermal-aware cell and through-silicon-via co-placement for 3D ICs
    12 years 4 months ago
    Thermal-aware cell and through-silicon-via co-placement for 3D ICs
    Download  cadlab.cs.ucla.edu
    Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
    Jason Cong, Guojie Luo, Yiyu Shi
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