3 search results - page 1 / 1 » Thermal-driven multilevel routing for 3-D ICs |
ASPDAC
2005
ACM
13 years 10 months ago
2005
ACM
3-D IC has a great potential for improving circuit performance and degree of integration. It is also an attractive platform for system-on-chip or system-in-package solutions. A cr...
ICCAD
2005
IEEE
14 years 1 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
ASPDAC
2005
ACM
13 years 10 months ago
2005
ACM
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...