28 search results - page 1 / 6 » Three-Dimensional Simulation of Semiconductor Devices |
HPCN
1994
Springer
13 years 9 months ago
1994
Springer
The exact knowledge of the heat flow in heterojunction bipolar transistors (HBT) during power operation is an important key factor for the systematic improvement of power density,...
PPSC
1997
13 years 6 months ago
1997
We present the results in embedding a multigrid solver for Poisson's equation into the parallel 3D Monte Carlo device simulator, PMC-3D. First we have implemented the sequent...
ICCD
2005
IEEE
14 years 1 months ago
2005
IEEE
As technology scales, interconnects dominate the performance and power behavior of deep submicron designs. Three-dimensional integrated circuits (3D ICs) have been proposed as a w...
EURODAC
1995
IEEE
13 years 8 months ago
1995
IEEE
A three level software system for thermal analysis of semiconductor devices, one-chip monolith IC's, multi-chip modules (MCM) and hybrid IC's is presented. For each desig...
DELTA
2002
IEEE
13 years 9 months ago
2002
IEEE
Teaching the practical aspects of device and chip design in New Zealand presents many problems, including high manufacturing costs, long lead times, and the lack of local industry...