3 search results - page 1 / 1 » Transient thermal analysis of multilayered structures using ... |
MR
2002
13 years 5 months ago
2002
This paper presents an approach to the analysis of transient thermal states in electronic circuits using an analytical solution of the heat equation. Fully three-dimensional analy...
ISQED
2007
IEEE
13 years 12 months ago
2007
IEEE
Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
ICCAD
2003
IEEE
14 years 2 months ago
2003
IEEE
Detailed electromagnetic analysis of three-dimensional structures in multilayered dielectric media is critical for automatic generation of equivalent circuit models for the interc...