57 search results - page 2 / 12 » Use Cases and Concepts for 3D Visualisation in Manufacturing |
IIE
2007
13 years 5 months ago
2007
Abstract. Issues related to 3d turtle’s navigation and geometrical figures’ manipulation in the simulated 3d space of a newly developed computational environment, MaLT, are re...
ADAPTIVE
2007
Springer
13 years 11 months ago
2007
Springer
In recent years, technological developments have made it possible to build interactive 3D models of objects and 3D Virtual Environments that can be experienced through the Web, usi...
CASES
2010
ACM
13 years 2 months ago
2010
ACM
3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
GLVLSI
2009
IEEE
13 years 3 months ago
2009
IEEE
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...
SLIP
2009
ACM
13 years 11 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...