291 search results - page 2 / 59 » Using STEAM for Thermal Simulation of Storage Systems |
ICPP
2007
IEEE
13 years 11 months ago
2007
IEEE
Compute clusters are consuming more power at higher densities than ever before. This results in increased thermal dissipation, the need for powerful cooling systems, and ultimatel...
ISQED
2007
IEEE
13 years 11 months ago
2007
IEEE
Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
DATE
2010
IEEE
13 years 10 months ago
2010
IEEE
—Packaging becomes an important issue in aerospace equipments because of high integration and severe environmental constraints. In order to develop products which respond to the ...
MASCOTS
2004
13 years 6 months ago
2004
A number of new network storage architectures have emerged recently that provide shared, adaptable and high-performance storage systems for dataintensive applications. Three commo...
TCAD
2008
13 years 5 months ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...