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» Using the DEVS Paradigm to Implement a Simulated Processor
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TCAD
2008
114views more  TCAD 2008»
13 years 5 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
DAGSTUHL
2011
12 years 5 months ago
Interactive Isocontouring of High-Order Surfaces
Scientists and engineers are making increasingly use of hp-adaptive discretization methods to compute simulations. While techniques for isocontouring the high-order data generated...
Christian Azambuja Pagot, Joachim E. Vollrath, Fil...