Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
Scientists and engineers are making increasingly use of hp-adaptive discretization methods to compute simulations. While techniques for isocontouring the high-order data generated...
Christian Azambuja Pagot, Joachim E. Vollrath, Fil...