Aggressive CMOS scaling will make future chip multiprocessors (CMPs) increasingly susceptible to transient faults, hard errors, manufacturing defects, and process variations. Exis...
This paper presents a parallelization framework for emerging applications on the future chip multiprocessors (CMPs). With the continuing prevalence of CMP and the number of on-die...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Modern FPGA devices, which include (multiple) processor core(s) as diffused IP on the silicon die, provide an excellent platform for developing custom multiprocessor systems-on-pr...
Jason Agron, Wesley Peck, Erik Anderson, David L. ...
With the shift to many-core chip multiprocessors (CMPs), a critical issue is how to effectively coordinate and manage the execution of applications and hardware resources to overc...
Wei Wang, Tanima Dey, Ryan W. Moore, Mahmut Aktaso...