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DAC
2011
ACM
12 years 4 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
GRAPHICSINTERFACE
2011
12 years 8 months ago
AppMap: exploring user interface visualizations
In traditional graphical user interfaces, the majority of UI elements are hidden to the user in the default view. Application designers and users desire more space for their appli...
Michael Rooke, Tovi Grossman, George W. Fitzmauric...
TMI
2011
108views more  TMI 2011»
12 years 11 months ago
Incorporation of a Left Ventricle Finite Element Model Defining Infarction Into the XCAT Imaging Phantom
—The 4D extended Cardiac-Torso (XCAT) phantom was developed to provide a realistic and flexible model of the human anatomy and cardiac and respiratory motions for use in medical ...
Alexander I. Veress, William Paul Segars, Benjamin...
DAC
2011
ACM
12 years 4 months ago
Supervised design space exploration by compositional approximation of Pareto sets
Technology scaling allows the integration of billions of transistors on the same die but CAD tools struggle in keeping up with the increasing design complexity. Design productivit...
Hung-Yi Liu, Ilias Diakonikolas, Michele Petracca,...