Twisted differential line structure can effectively reduce crosstalk noise on global bus, which foresees a wide applicability. However, measured performance based on fabricated ci...
The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literatur...
Negative bias temperature instability (NBTI) in MOSFETs is one of the major reliability challenges in nano-scale technology. This paper presents an efficient technique to characte...
Kunhyuk Kang, Kee-Jong Kim, Ahmad E. Islam, Muhamm...
In this paper, we present a new multi-packing tree (MP-tree) representation for macro placement to handle mixed-size designs. Based on binary trees, the MP-tree is very efficient,...
It is now common for multimedia applications to be partitioned and mapped onto multiple processing elements of a system-on-chip architecture. An important design constraint in suc...