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DAC
2011
ACM
12 years 4 months ago
2011
ACM
Technology scaling allows the integration of billions of transistors on the same die but CAD tools struggle in keeping up with the increasing design complexity. Design productivit...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
Clock tree synthesis is one of the most important and challenging problems in 3D ICs. The clock signals have to be delivered by through-silicon vias (TSVs) to different tiers with...
ICASSP
2011
IEEE
12 years 8 months ago
2011
IEEE
In this paper a novel approach for broadband feedback active noise control (ANC) is presented which is based on the combination of classical non-adaptive feedback and adaptive fee...