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ICCAD
2010
IEEE
13 years 3 months ago
2010
IEEE
Through-silicon via (TSV) fabrication causes tensile stress around TSVs which results in significant carrier mobility variation in the devices in their neighborhood. Keep-out zone ...
ICCAD
2010
IEEE
13 years 2 months ago
2010
IEEE
Coarse-grain multi-threshold CMOS (MTCMOS) is an effective power-gating technique to reduce IC's leakage power consumption by turning off idle devices with MTCMOS power switc...
ATS
2010
IEEE
13 years 1 months ago
2010
IEEE
Systems with many integrated circuits (ICs), often of the same type, are increasingly common to meet the constant performance demand. However, systems in recent semiconductor techn...
TWC
2010
12 years 12 months ago
2010
In this letter, we address the problem of distributed multi-antenna cooperative transmission in a cellular system. Most research in this area has so far assumed that base stations ...
BMCBI
2010
13 years 5 months ago
2010
Background: The amount of available biological information is rapidly increasing and the focus of biological research has moved from single components to networks and even larger ...