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SLIP
2009
ACM
13 years 12 months ago
From 3D circuit technologies and data structures to interconnect prediction
New technologies such as 3D integration are becoming a new force that is keeping Moore’s law in effect in today’s nano era. By adding a third dimension in current 2D circuits...
Robert Fischbach, Jens Lienig, Tilo Meister
SLIP
2009
ACM
13 years 12 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
SLIP
2009
ACM
13 years 12 months ago
Floorplan-based FPGA interconnect power estimation in DSP circuits
A novel high-level approach for estimating power consumption of global interconnects in data-path oriented designs implemented in FPGAs is presented. The methodology is applied to...
Ruzica Jevtic, Carlos Carreras, Vukasin Pejovic
SLIP
2009
ACM
13 years 12 months ago
Honeycomb-structured computational interconnects and their scalable extension to spherical domains
The present paper is part of a larger effort to redesign, from the ground up, the best possible interconnect topologies for switchless multiprocessor computer systems. We focus he...
Joseph B. Cessna, Thomas R. Bewley
SLIP
2009
ACM
13 years 12 months ago
Prediction of high-performance on-chip global interconnection
Different interconnection structures have been proposed to solve the performance limitation caused by scaling of on-chip global wires. In this paper, we give an overview of curre...
Yulei Zhang, Xiang Hu, Alina Deutsch, A. Ege Engin...