Sciweavers

ISCAS
2008
IEEE
117views Hardware» more  ISCAS 2008»
13 years 11 months ago
Electrical modeling and characterization of 3-D vias
Abstract— Electrical characterization of the resistance, capacitance, and inductance of inter-plane 3-D vias is presented in this paper. Both capacitive and inductive coupling be...
Ioannis Savidis, Eby G. Friedman