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    ASPDAC
    2009
    ACM
    153views Hardware» more  ASPDAC 2009»
    A 3D prototyping chip based on a wafer-level stacking technology
    13 years 2 months ago
    A 3D prototyping chip based on a wafer-level stacking technology
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    We have developed a new 3-dimensional stacking technology using wafer-to-wafer stacked method and evaluated the connectivity between TSV and micro-bump. The prototype 3-layer stac...
    Nobuaki Miyakawa
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