DAC
2012
ACM
11 years 7 months ago
2012
ACM
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
ICIP
2006
IEEE
14 years 6 months ago
2006
IEEE
This paper presents a new diffusion scheme on statistical manifolds for the detection of texture boundaries. The technique derives from our previous work, in which 2-dimensional R...