Sciweavers

FTEDA
2008
75views more  FTEDA 2008»
13 years 5 months ago
Thermally Aware Design
With greater integration, the power dissipation in integrated circuits has begun to outpace the ability of today's heat sinks to limit the on-chip temperature. As a result, t...
Yong Zhan, Sanjay V. Kumar, Sachin S. Sapatnekar