ic package | Sciweavers

9

MVA
1998

110views Computer Vision» more MVA 1998»

A fast algorithm for detecting die extrusion defects in IC packages

13 years 4 months ago

In this paper, we present a fast method for the detection of die extrusion defects in IC packages. The optical and lighting set-up as well as the details of the algorithm used for ...

H. Zhou, Ashraf A. Kassim, S. Ranganath

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7

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MVA
2000

152views Computer Vision» more MVA 2000»

Automatic IC orientation checks

13 years 4 months ago

Download www.cs.ucf.edu

With the proliferation of different types of IC packages, there is a need for machine-vision-based inspection systems to be able to efficiently identify the orientation of IC packa...

Ashraf A. Kassim, H. Zhou, S. Ranganath

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4

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MVA
2007

146views Computer Vision» more MVA 2007»

A SVM Based Method to Detect Color Shift Defects in IC Packages

13 years 6 months ago

Download b2.cvl.iis.u-tokyo.ac.jp

Automated Visual Inspection (AVI) is an essential part in the manufacturing process of Integrated Circuit (IC) packages. Contamination a common defect type found in IC packages ap...

R. M. C. B. Ratnayake, Craig Hicks, M. A. Akbari

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