A fast algorithm for detecting die extrusion defects in IC packages

In this paper, we present a fast method for the detection of die extrusion defects in IC packages. The optical and lighting set-up as well as the details of the algorithm used for the isolation and detection of die extrusion defects are presented. Our algorithm basically involves the use of optimal filters for the detection of linear features and other feature enhancement techniques. This paper also addresses implementation issues including speed, effectiveness, and robustness. Key words: IC package inspection – Die extrusion defects – Linear feature extraction – Feature enhancement

• Type: Journal
• Year: 1998
• Where: MVA
• Authors: H. Zhou, Ashraf A. Kassim, S. Ranganath
• Keywords: Computer Vision, Extrusion Defects, Feature Enhancement, Ic Package, MVA 1998