ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
Most existing buffering algorithms neglect the impact of inductance on circuit performance, which causes large error in circuit analysis and optimization. Even for the approaches...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
—Decoupling capacitors (decaps) are a popular means for reducing power-supply noise in integrated circuits. Since the decaps are usually inserted in the whitespace of the device ...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
The International Technology Roadmap for Semiconduc-tors (ITRS) seeks to stimulate invention and research lead-ing to one or more new nanoelectronics technologies that may extend ...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
As CMOS technology scales into the nanometer regime, power dissipation and associated thermal concerns in high-performance ICs due to on-chip hot-spots and thermal gradients are b...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
Leveraging conventional microsystems technology, MEMS has become the technology of choice for a wide range of applications including inertial sensors for automotive, games, and co...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
Statistical static timing analysis (SSTA) has become a key method for analyzing the effect of process variation in aggressively scaled CMOS technologies. Much research has focused...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
— Trajectory-based methods offer an attractive methodology for automated, on-demand generation of macromodels for custom circuits. These models are generated by sampling the stat...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...