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ICCAD
2010
IEEE
176views Hardware» more  ICCAD 2010»
8 years 10 months ago
An auction based pre-processing technique to determine detour in global routing
Global Routing has been a traditional EDA problem. It has congestion elimination as the first and foremost priority. Despite of the recent development for popular rip-up and rerout...
Yue Xu, Chris Chu
ICCAD
2010
IEEE
108views Hardware» more  ICCAD 2010»
8 years 10 months ago
Mathematical yield estimation for two-dimensional-redundancy memory arrays
Defect repair has become a necessary process to enhance the overall yield for memories since manufacturing a natural good memory is difficult in current memory technologies. This ...
Mango Chia-Tso Chao, Ching-Yu Chin, Chen-Wei Lin
ICCAD
2010
IEEE
133views Hardware» more  ICCAD 2010»
8 years 10 months ago
Testing methods for detecting stuck-open power switches in coarse-grain MTCMOS designs
Coarse-grain multi-threshold CMOS (MTCMOS) is an effective power-gating technique to reduce IC's leakage power consumption by turning off idle devices with MTCMOS power switc...
Szu-Pang Mu, Yi-Ming Wang, Hao-Yu Yang, Mango Chia...
ICCAD
2010
IEEE
224views Hardware» more  ICCAD 2010»
8 years 11 months ago
WISDOM: Wire spreading enhanced decomposition of masks in Double Patterning Lithography
In Double Patterning Lithography (DPL), conflict and stitch minimization are two main challenges. Post-routing mask decomposition algorithms [1
Kun Yuan, David Z. Pan
ICCAD
2010
IEEE
229views Hardware» more  ICCAD 2010»
8 years 11 months ago
Obstacle-avoiding rectilinear Steiner minimum tree construction: An optimal approach
In this paper, we present an efficient method to solve the obstacle-avoiding rectilinear Steiner minimum tree (OARSMT) problem optimally. Our work is a major improvement over the w...
Tao Huang, Evangeline F. Y. Young
ICCAD
2010
IEEE
114views Hardware» more  ICCAD 2010»
8 years 11 months ago
Redundant-wires-aware ECO timing and mask cost optimization
Shao-Yun Fang, Tzuo-Fan Chien, Yao-Wen Chang
ICCAD
2010
IEEE
126views Hardware» more  ICCAD 2010»
8 years 11 months ago
ESL solutions for low power design
Sylvian Kaiser, Ilija Materic, Rabih Saade
ICCAD
2010
IEEE
216views Hardware» more  ICCAD 2010»
8 years 11 months ago
Stress-driven 3D-IC placement with TSV keep-out zone and regularity study
Through-silicon via (TSV) fabrication causes tensile stress around TSVs which results in significant carrier mobility variation in the devices in their neighborhood. Keep-out zone ...
Krit Athikulwongse, Ashutosh Chakraborty, Jae-Seok...
ICCAD
2010
IEEE
162views Hardware» more  ICCAD 2010»
8 years 11 months ago
Practical placement and routing techniques for analog circuit designs
1In this paper, we will present an effective layout method for analog circuits. We consider symmetry constraint, common centroid constraint, device merging and device clustering du...
Linfu Xiao, Evangeline F. Y. Young, Xiaoyong He, K...
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