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ISLPED
2003
ACM
113views Hardware» more  ISLPED 2003»
13 years 10 months ago
Reducing power density through activity migration
Power dissipation is unevenly distributed in modern microprocessors leading to localized hot spots with significantly greater die temperature than surrounding cooler regions. Exc...
Seongmoo Heo, Kenneth C. Barr, Krste Asanovic
ITC
2003
IEEE
90views Hardware» more  ITC 2003»
13 years 10 months ago
Burn-in Temperature Projections for Deep Sub-micron Technologies
Burn-in faces significant challenges in recent CMOS technologies. The self-generated heat of each IC in a burn-in environment contributes to larger currents that can lead to furth...
Oleg Semenov, Arman Vassighi, Manoj Sachdev, Ali K...