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ISQED
2009
IEEE
94views Hardware» more  ISQED 2009»
13 years 11 months ago
Simultaneous buffer and interlayer via planning for 3D floorplanning
As technology advances, the interconnect delay among modules plays dominant role in chip performance. Buffer insertion, as a traditional approach to reduce wire delay in 2D ICs, i...
Xu He, Sheqin Dong, Yuchun Ma, Xianlong Hong