ICPP
2000
IEEE
13 years 9 months ago
2000
IEEE
Current VLSI technology allows more than two wiring layers and the number is expected to rise in future. In this paper, we show that, by designing VLSI layouts directly for an L-l...
ISQED
2003
IEEE
13 years 10 months ago
2003
IEEE
To save layout area for electrostatic discharge (ESD) protection design in the SOC era, test chip with large size NMOS devices placed under bond pads has been fabricated in 0.35-Â...