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TCAD
2008
115views more  TCAD 2008»
13 years 4 months ago
Statistical Thermal Profile Considering Process Variations: Analysis and Applications
The nonuniform substrate thermal profile and process variations are two major concerns in the present-day ultradeep submicrometer designs. To correctly predict performance/ leakage...
Javid Jaffari, Mohab Anis
ICCD
2007
IEEE
180views Hardware» more  ICCD 2007»
14 years 1 months ago
Improving the reliability of on-chip data caches under process variations
On-chip caches take a large portion of the chip area. They are much more vulnerable to parameter variation than smaller units. As leakage current becomes a significant component ...
Wei Wu, Sheldon X.-D. Tan, Jun Yang 0002, Shih-Lie...