DAC
2012
ACM
11 years 7 months ago
2012
ACM
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
DATE
1999
IEEE
13 years 9 months ago
1999
IEEE
The objective of this paper is to define a minimum number of configurations for testing the configurable modules that interface the global interconnect and the logic cells of SRAM...