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    HPCA
    2009
    IEEE
    212views Distributed And Parallel Com...» more  HPCA 2009»
    A low-radix and low-diameter 3D interconnection network design
    14 years 5 months ago
    A low-radix and low-diameter 3D interconnection network design
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    Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and hi...
    Bo Zhao, Jun Yang 0002, Xiuyi Zhou, Yi Xu, Youtao ...
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