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    VTS
    1999
    IEEE
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    A New Bare Die Test Methodology
    13 years 9 months ago
    A New Bare Die Test Methodology
    Download  cadlab.ece.ucsb.edu
    1 While multichip module technology has been developed for high performance IC applications, the technology is not widely adopted due to economical reasons. One of the reasons that...
    Zao Yang, K.-T. Cheng, K. L. Tai
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