LATIN
2010
Springer
13 years 11 months ago
2010
Springer
We consider the relationship between size and depth for layered Boolean circuits, synchronous circuits and planar circuits as well as classes of circuits with small separators. In ...
DAC
2007
ACM
14 years 5 months ago
2007
ACM
Three-Dimensional integration provides a simultaneous improvement in wire-related delay and power consumption of microprocessor circuits. Prior work has looked at the performance,...