Sciweavers

    MR
    2006
    58views Robotics» more  MR 2006»
    Drop impact reliability testing for lead-free and lead-based soldered IC packages
    13 years 5 months ago
    Drop impact reliability testing for lead-free and lead-based soldered IC packages
    Download  www.utacgroup.com
    Board-level drop impact testing is a useful way to characterize the drop durability of the different soldered assemblies onto the printed circuit board (PCB). The characterization...
    Desmond Y. R. Chong, F. X. Che, John H. L. Pang, K...
    claim paper
    Read More »
    Explore & Download
    Proceedings Preprints Top 5 Ranked Papers Publications Books Software Tutorials Presentations Lectures Notes Datasets
    Productivity Tools
    International On-screen Keyboard Graphical Social Symbols OCR Text Recognition CSS3 Style Generator Web Page to PDF Web Page to Image PDF Split PDF Merge Latex Equation Editor Sci2ools
    Document Tools
    PDF to Text PDF to Postscript PDF to Thumbnails Excel to PDF Word to PDF Postscript to PDF PowerPoint to PDF Latex to Word Repair Corrupted PDF
    Image Tools
    JPG to PS JPG to PDF Extract Images from PDF Image Converter
    Sciweavers
    About Community Cookies Privacy Policy Terms of Use

    Copyright © Sciweavers LLC, 2009-2024, USA.