Drop impact reliability testing for lead-free and lead-based soldered IC packages

Board-level drop impact testing is a useful way to characterize the drop durability of the different soldered assemblies onto the printed circuit board (PCB). The characterization process is critical to the lead-free (Pb-free) solders that are replacing lead-based (Pb-based) solders. In this study, drop impact solder joint reliability for plastic ball grid array (PBGA), very-thin quad flat no-lead (VQFN) and plastic quad flat pack (PQFP) packages was investigated for Pbbased (62Sn

• Type: Journal
• Year: 2006
• Where: MR
• Authors: Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low
• Keywords: Board-level Drop Impact, MR 2006, PBGA Solder Joints, Robotics, Solder Joints