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    3DIC
    2009
    IEEE
    178views Hardware» more  3DIC 2009»
    Investigation and comparison of thermal distribution in synchronous and asynchronous 3D ICs
    13 years 8 months ago
    Investigation and comparison of thermal distribution in synchronous and asynchronous 3D ICs
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    This paper presents an analysis and comparison between synchronous and delay-insensitive asynchronous logic circuits on thermal distributions for investigating novel solutions to t...
    Brent Hollosi, Tao Zhang, Ravi Sankar Parameswaran...
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