Investigation and comparison of thermal distribution in synchronous and asynchronous 3D ICs

This paper presents an analysis and comparison between synchronous and delay-insensitive asynchronous logic circuits on thermal distributions for investigating novel solutions to the heat dissipation problem in three-dimensional ICs. Due to the spatial and temporal distribution of switching activities in delay-insensitive asynchronous circuits, the thermal density as well as the temperature is largely reduced. Results show that the sample delay-insensitive asynchronous circuit exhibits lower average temperature and more uniform thermal distribution compared to it’s synchronous counterpart.

• Type: Conference
• Year: 2009
• Where: 3DIC
• Authors: Brent Hollosi, Tao Zhang, Ravi Sankar Parameswaran Nair, Yuan Xie, Jia Di, Scott C. Smith
• Keywords: 3DIC 2009, Asynchronous Logic Circuits, Delay-insensitive Asynchronous Circuit, Hardware, Thermal Distribution