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    ISLPED
    2009
    ACM
    110views Hardware» more  ISLPED 2009»
    SOI, interconnect, package, and mainboard thermal characterization
    13 years 11 months ago
    SOI, interconnect, package, and mainboard thermal characterization
    Download  masc.soe.ucsc.edu
    This paper presents an evaluation to determine the importance of the accurate thermal characterization for several elements of a semiconductor device. Specifically, it evaluates ...
    Joseph Nayfach-Battilana, Jose Renau
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