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ASPDAC
2006
ACM
166views Hardware» more  ASPDAC 2006»
13 years 11 months ago
Temperature-aware routing in 3D ICs
Three-dimensional integrated circuits (3D ICs) provide an attractive solution for improving circuit performance. Such solutions must be embedded in an electrothermally-conscious d...
Tianpei Zhang, Yong Zhan, Sachin S. Sapatnekar