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    ASPDAC
    2009
    ACM
    104views Hardware» more  ASPDAC 2009»
    Addressing thermal and power delivery bottlenecks in 3D circuits
    13 years 11 months ago
    Addressing thermal and power delivery bottlenecks in 3D circuits
    Download  www.ece.umn.edu
    — The enhanced packing densities facilitated by 3D integrated circuit technology also has an unwanted side-effect, in the form of increasing the amount of current per unit footpr...
    Sachin S. Sapatnekar
    claim paper
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