DAC
2012
ACM
11 years 7 months ago
2012
ACM
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
DATE
2005
IEEE
13 years 10 months ago
2005
IEEE
— This paper suggests a methodology to decrease the power of a static CMOS standard cell design at layout level by focusing on switched capacitance. The term switched is the key:...