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ISPD   2011 International Symposium on Physical Design
Wall of Fame | Most Viewed ISPD-2011 Paper
ISPD
2011
ACM
253views Hardware» more  ISPD 2011»
7 years 8 months ago
Assembling 2D blocks into 3D chips
Three-dimensional ICs promise to signi´Čücantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
Johann Knechtel, Igor L. Markov, Jens Lienig
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