A Comparative Study on Dicing of Multiple Project Wafers

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This paper carries out a comparative study on the methods of dicing multi-project wafers (MPW). Our dicing method results in using 40% fewer wafers both for low and high volume production.

Meng-Chiou Wu, Rung-Bin Lin

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Fewer Wafers | ISVLSI 2005 | Multi-project Wafers |

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Added	25 Jun 2010
Updated	25 Jun 2010
Type	Conference
Year	2005
Where	ISVLSI
Authors	Meng-Chiou Wu, Rung-Bin Lin

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A Comparative Study on Dicing of Multiple Project Wafers

Fewer Wafers | ISVLSI 2005 | Multi-project Wafers |

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