36 search results - page 1 / 8 » A Comparative Study on Dicing of Multiple Project Wafers |
ISVLSI
2005
IEEE
13 years 11 months ago
2005
IEEE
This paper carries out a comparative study on the methods of dicing multi-project wafers (MPW). Our dicing method results in using 40% fewer wafers both for low and high volume pr...
ISQED
2005
IEEE
13 years 11 months ago
2005
IEEE
Multi-project wafer having several chips placed on the same reticle to lower mask cost is key to low-volume IC fabrication. In this paper1 , we proposed two MILP models for simult...
ASPDAC
2006
ACM
13 years 11 months ago
2006
ACM
—As the VLSI manufacturing technology advances into the deep sub-micron(DSM) era, the mask cost can reach one or two million dollars. Multiple project wafers (MPW) which put diï¬...
ISCAS
2005
IEEE
13 years 11 months ago
2005
IEEE
—Multi-project wafer (MPW) is commonly used for low-volume IC production. In this paper, we study whether it can be used for medium-volume production. Cost equations are develope...
SC
2009
ACM
2009
ACM
Comparative study of one-sided factorizations with multiple software packages on multi-core hardware
13 years 10 months ago
The emergence and continuing use of multi-core architectures require changes in the existing software and sometimes even a redesign of the established algorithms in order to take ...