Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies

Gold to Gold Interconnection (GGI) flip chip bonding technology has been developed to bond the driver IC chip on the integrated circuit suspension used in hard disk drives (HDDs). GGI is a lead free process where the Au bumps and Au bond pads are joined together by heat and ultrasonic power under a pressure head.

• Type: Journal
• Year: 2002
• Where: MR
• Authors: C. F. Luk, Y. C. Chan, K. C. Hung
• Keywords: Au Bond Pads, Chip Bonding Technology, Driver Ic Chip, MR 2002, Robotics