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    MR
    2002
    87views Robotics» more  MR 2002»
    Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies
    13 years 4 months ago
    Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies
    Download  www.ee.cityu.edu.hk
    Gold to Gold Interconnection (GGI) flip chip bonding technology has been developed to bond the driver IC chip on the integrated circuit suspension used in hard disk drives (HDDs)....
    C. F. Luk, Y. C. Chan, K. C. Hung
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    ISQED
    2003
    IEEE
    123views Hardware» more  ISQED 2003»
    Advanced Module Packaging Method
    13 years 10 months ago
    Advanced Module Packaging Method
    Download  www.cecs.uci.edu
    An intermediate solution between conventional printed circuit board technology and wafer level packaging, WLP, is to fabricate interconnection circuits and flip chip assembly stru...
    Peter C. Salmon
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