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ICCAD
2003
IEEE

Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach

14 years 16 days ago
Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach
As the technology node progresses, thermal problems are becoming more prominent especially in the developing technology of three-dimensional (3D) integrated circuits. The thermal placement method presented in this paper uses an iterative force-directed approach in which thermal forces direct cells away from areas of high temperature. Finite element analysis (FEA) is used to calculate temperatures efficiently during each iteration. Benchmark circuits produce thermal placements with both lower temperatures and thermal gradients while wirelength is minimally affected.
Brent Goplen, Sachin S. Sapatnekar
Added 16 Mar 2010
Updated 16 Mar 2010
Type Conference
Year 2003
Where ICCAD
Authors Brent Goplen, Sachin S. Sapatnekar
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